Thermoplastic High-Performance Compound "TECACOMP LDS"
Plastic for laser direct structuring with heat resistance of 260℃.
"TECACOMP LDS" is a thermoplastic high-performance compound that enables the formation of extremely fine wiring due to its microstructure. This allows for compatibility with applications that require miniaturization. With an optimized compound formulation, wiring with strong adhesion and durability can be achieved. 【Features】 ■ It has heat resistance up to 260°C and is compatible with conventional plating technologies. ■ Fine wiring down to 70μm can be achieved with an appropriate filler formulation. ■ PEEK and LCP grades realize high dimensional stability with low thermal expansion coefficients. ■ PPA grade improves cooling performance due to good thermal conductivity. *For more details, please refer to the PDF document or feel free to contact us.
- Company：エンズィンガージャパン
- Price：Other
